Effects of interatomic potentials on the determination of the minimum depth of cut in nanomachining.

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dc.contributor.authorOLUWAJOBI, A.O.
dc.contributor.authorCHEN, X.
dc.date.accessioned2023-05-13T17:06:45Z
dc.date.available2023-05-13T17:06:45Z
dc.date.issued2013-01
dc.descriptionInternational Journal of Abrasive Technology,Vol. 6,Issue No.1,P.16–39.en_US
dc.description.abstractThe minimum depth of cut (MDC) is a major limiting factor on achievable accuracy in nanomachining, because the generated surface roughness is primarily attributed to the ploughing process when the uncut chip thickness is less than the MDC. This paper presents the material removal in a nanomachining process, where a sharp diamond tool with an edge radius of few atoms acts on a crystalline copper workpiece. The molecular dynamics (MD) simulation results show the phenomena of rubbing, ploughing and cutting. The formation of chip occurred from the depth of cut thickness of 1~1.5 nm. Also, the effects of the interatomic potentials on the MDC have been presenteden_US
dc.identifier.urihttps://ir.oauife.edu.ng/123456789/5457
dc.language.isoenen_US
dc.publisherInternational Journal of Abrasive Technologyen_US
dc.subjectminimum depth of cut;en_US
dc.subjectnanomachining;en_US
dc.subjectmolecular dynamics simulation;en_US
dc.subjecttool-workpiece interface;en_US
dc.subjectinteratomic potentials.en_US
dc.titleEffects of interatomic potentials on the determination of the minimum depth of cut in nanomachining.en_US
dc.typeJournalen_US
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